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The Thin Film type platinum RTD chip-based design (integrated circuit) technology.

The Thin Film type platinum RTD chip-based design (integrated circuit) technology.

Unlike ceramics, the thin Film sensor uses a platinum layer applied to a high purity ceramic substrate through the sputter system.

Sputtering is a process  which particles are ejected from a solid target material by bombarding the target with energetic particles, mainly with gas ions in the laboratory. This only happens when the kinetic energy of the incoming particles is much higher than conventional thermal energies.

 

This process can lead to significant erosion of the materials, during prolonged material bombardment by ions or plasma. It is commonly used for thin Film deposition.

The platinum layer is then structured using a photolithography system and achieves the final shape of a meander. The final resistance value is obtained by a laser system.

 

The typical range of use of Thin Film type sensing elements varies between -70°C and +600°C.

As result of their small size and, consequently, low mass, Thin Film sensors provide a fast response to temperature variations.